|
项目 |
指标 |
1 |
材料类型 |
XPC.FR-1.FR-2.FR-4.FR-5.CEM-1.CEM-3.G10.22F |
2 |
基板/铜箔厚 |
0.4-3.2MM/0.25-3OZ |
3 |
最小线宽/线距 |
0.75MM(3mil) |
4 |
最小孔径 |
Sigle-side:0.6mm(24mil) Double-sided/multi layer:0.25(10mil) |
|
|
孔位 |
+/-0.075mm(3mil)CNC Driling |
|
|
线宽 |
+/-0.005mm(2mil) or +/-20% of Original artwork |
5 |
尺寸公差 |
孔径 |
PTH+/-0.075mm(3mil) Non-PTH+/-0.05(2mil) |
|
|
外型公差 |
+/-0.15mm(6mil) by CNC Routing +/-0.10(4mil) by Punching |
|
|
翘起度 |
0.70% |
6 |
焊盘表面处理 |
Nikel/Gold Plating/Entek/Hot Air Leveling/OSP/Preflux |
7 |
绝缘电阻 |
10Khm~20Mohm |
8 |
传导电阻 |
<50 ohm |
9 |
测试电压 |
300V |
|
|
拼板尺寸 |
110x110mm(min.) 660x660(max.) |
|
|
板厚 |
0.6mm(24mil)min. |
|
|
保留厚度 |
0.3mm(12mil)max |
10 |
V-CUT |
公差 |
+/-0.1mm(4mil) |
|
|
槽宽 |
0.50mm(20mil)max |
|
|
槽到槽 |
10mm min |
|
|
槽到线 |
0.50mm(20mil)max |
11 |
槽 |
公差 |
PTH L:+/-0.15mm(6mil) W:+/-0.1mm(4mil) |
|
|
NPTH L:+/-0.125mm(5mil) W:+/-0.1mm(4mil) |
12 |
孔边至图形的最小距离 |
PTH Hole:0.13mm(5mil) |
|
|
NPTH Hole:0.18mm(7mil) |
13 |
圆形偏差 |
0.075mm(3milL) |
|
|
层间距离 |
4layers:0.15mm(6mil)max |
|
|
|
6layers:0.25mm(10mil)max |
|
|
孔边至内层图形的最小距离 |
0.25mm(10mil) |
14 |
多层板 |
板边缘至内层图形的最小距离 |
0.25mm(10mil) |
|
|
板厚公差 |
4layers:0.13mm(5mil) |
|
|
|
6layers:0.15mm(6mil) |
|
|
特性阻抗 |
60 ohm +/-10% |
